#3nm chip China

Huawei is reportedly preparing to take another major step in its comeback strategy by entering 3nm chip production by 2026, according to industry insiders. Despite ongoing challenges, Huawei has made impressive progress with its in-house chip development arm, HiSilicon, and through partnerships with SMIC (Semiconductor Manufacturing International Corporation), China’s leading semiconductor foundry. Sources suggest that Huawei and SMIC are laying the groundwork to begin production of 3nm-class chips by 2026, following the reported success of their 7nm and 5nm chip developments in limited batches. The production may not match the yields or efficiency of chips made by industry leaders like TSMC or Samsung, but it signals a bold technological ambition and the possibility of homegrown alternatives in China’s tech stack. If Huawei and SMIC can indeed achieve even partial success at the 3nm level, it would be a symbolic and strategic milestone—not just for Huawei, but for China’s broader push toward semiconductor self-sufficiency. The H200 is far more powerful than the downgraded H20 chips currently sold in China, though it still trails Nvidia’s latest Blackwell processors, which remain restricted. Analysts believe Beijing may ease its stance toward Nvidia following Trump’s talks with President Xi, but in the long run, China is expected to continue investing heavily in its own AI chips through companies like Huawei, Cambricon, and Moore Threads. Read more in our articles including "Huawei Reportedly Planning 3nm Chip Production by 2026" and "US Approves Nvidia H200 Chip Exports to China with 25% Fee".