#Dimensity 1300

MediaTek announced the Dimensity 1300 built on TSMC's 6nm process that features an octa-core processor, along with the Arm Mali-G77 MC9 graphics processor. The Dimensity 1300 has an octa-core processor with four Cortex-A78 cores running up to 3GHz and another four Cortex-A55 efficiency cores that scale up to 2Ghz. Not much details on the devices that will be launched with the Dimensity 1300 first Lastly, this new processor is rated for integrated 5G with 4x4 MIMO as well as 2 x WiFi 6 and Bluetooth 5.2 creating more opportunities for the mid-range devices. MediaTek introduces a new 5G-capable processor for upper mid-range smartphones, the Dimensity 820 chip. The Dimensity 820 combines advancements in artificial intelligence, multimedia, and imaging. As a fully-fledged 5G processor, the Dimensity 820 comes with Carrier Aggregation (CA) technology for seamless handover between two 5G connection areas. The Dimensity 820 also supports dual SIM, dual standby for 5G connectivity, Voice over New Radio (VoNR) services, and is designed for locations with sub-6GHz 5G networks in North America, Asia, and Europe. MediaTek has announced that it has partnered up with Intel, and will be launching a lineup of 5G chipsets called Dimensity. Read more in our articles including "MediaTek Dimensity 1300 w/ support for up to 168hz displays now official" and "MediaTek intros Dimensity 820 chip with improved 5G capabilities".