#dimensity 7300

MediaTek has today introduced its latest innovations in mobile processing technology with the announcement of the Dimensity 7300 and Dimensity 7300X chipsets. The Dimensity 7300 chipsets are engineered for smooth multitasking, superior photography, accelerated gaming, and advanced AI-enhanced computing. Notably, the Dimensity 7300X is optimized for flip-style foldable devices, offering robust support for dual displays. Leveraging the 4nm process, the new CPUs achieve up to 25% lower power consumption in the A78 cores compared to the previous Dimensity 7050. “The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game,” said Dr. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.” In terms of photography, the Dimensity 7300 series is equipped with the MediaTek Imagiq 950, which includes a high-end 12-bit HDR-ISP supporting a 200MP main camera. The chipsets enhance live focus photo performance by up to 1.3 times and photo remastering by up to 1.5 times faster than the Dimensity 7050. The MediaTek APU 655 significantly boosts AI task efficiency, doubling the performance of the Dimensity 7050. Read more in our articles including "MediaTek releases Dimensity 7300 and 7300X 4nm chips for smartphones" and "moto G86 5G, G86 Power launched: both run Dimensity 7300 SoC, up to 6720mAh battery".