#Dimensity 8300

MediaTek has announced the Dimensity 8300 as its latest addition to its 8000-series of midrange chipsets. Harnessing the second-generation TSMC 4-nanometer process, the new system-on-chip (SoC) brings significant performance boost over its predecessor, the Dimensity 8200. The Dimensity 8300 has eight Arm CPU cores based on Armv9 CPU architecture. Dimensity 8300 brings on-device generative AI to the table through its next-generation APU 780 AI processor. Connectivity-wise, the Dimensity 8300 now has Wi-Fi 6E and Bluetooth 5.4 connectivity. Xiaomi’s sub-brand Redmi already announced that its Redmi K70E powered by the Dimensity 8300 will debut later this month. [caption id="attachment_347304" align="alignnone" width="1200"] MediaTek Dimensity 8300 Infographics[/caption] MediaTek has announced that it has partnered up with Intel, and will be launching a lineup of 5G chipsets called Dimensity. Read more in our articles including "MediaTek Dimensity 8300 unveiled: 4nm, 3.35GHz Arm Cortex-A715, on-device generative AI" and "MediaTek announces Dimensity 1000 5G SoC".