#Qualcomm Snapdragon X60

Qualcomm is launching its third-generation Modem-RF System designed for 5G, the Snapdragon X60. The Snapdragon X60 is designed to provide operators more flexibility by utilizing a mix of frequency bands (mmWave, sub-6GHz, including low bands), band types (5G, Frequency Division Duplex (FDD), and Time Division Duplex (TDD)), and deployment modes (SA and NSA) to get high-speed and low-latency network coverage. The Snapdragon X60 modem features: the latest 5nm process node to improve power efficiency and space Support for 5G TDD-TDD sub-6 carrier aggregation to improve coverage and peak speeds (up to twice the peak speed of the past generation Snapdragon X55 when using a SA network). New Qualcomm QTM535 mmWave antenna module is smaller, allowing for sleeker smartphone designs Capable of delivering up to 7.5 Gbps download speed with 3 Gbps upload speed The new Snapdragon X60 modems will reportedly be used in devices from the first quarter of 2021. Qualcomm has announced that its annual Snapdragon Summit will take place from September 22 to 24, 2026, in Hawaii, where the company is expected to introduce its next-generation Snapdragon processors. While Qualcomm has not officially confirmed the products that will be unveiled during the summit, the Snapdragon Summit has traditionally served as the company's stage for introducing its flagship mobile platforms. Read more in our articles including "Qualcomm launches 3rd gen Snapdragon X60 5G Modem-RF System" and "Qualcomm announces dates for Snapdragon Summit 2026".