Additionally, it will reportedly utilize TSMC’s cutting-edge 3nm process, promising better power efficiency and performance improvements. The flagship Dimensity system-on-chip (SoC) from MediaTek has been taped out utilizing the 3nm technology from TSMC (TWSE: 2330, NYSE: TSM) with commercial manufacturing is anticipated to begin next year. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“ High performance computing and mobile applications may benefit from TSMC's 3nm process technology, that offers improved performance and power. TSMC's 3nm technology now promises up to an 18% speed boost at the same power, a 32% power reduction at the same speed, and a roughly 60% increase in logic density when compared to the N5 process. MediaTek's first flagship chipset employing TSMC's 3nm process is set to power smartphones, tablets, intelligent automobiles, and numerous other gadgets in the second half of 2024. Both chips will be built on TSMC’s cutting-edge third-generation 3nm process, known as N3P. For reference, the A18 lineup uses TSMC's earlier N3B process. Read more in our articles including "Qualcomm’s Next Snapdragon 8 Elite Chipset Might Arrive Early in 2025" and "MediaTek develops chip with TSMC's 3nm process".
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May 7, 2026Additionally, it will reportedly utilize TSMC’s cutting-edge 3nm process, promising better power efficiency and performance improvements. The flagship Dimensity system-on-chip (SoC) from MediaTek has been taped out utilizing the 3nm technology from TSMC (TWSE: 2330, NYSE: TSM) with commercial manufacturing is anticipated to begin next year.
“Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“ High performance computing and mobile applications may benefit from TSMC's 3nm process technology, that offers improved performance and power. TSMC's 3nm technology now promises up to an 18% speed boost at the same power, a 32% power reduction at the same speed, and a roughly 60% increase in logic density when compared to the N5 process. MediaTek's first flagship chipset employing TSMC's 3nm process is set to power smartphones, tablets, intelligent automobiles, and numerous other gadgets in the second half of 2024.
Our coverage of TSMC 3nm process includes: "Qualcomm’s Next Snapdragon 8 Elite Chipset Might Arrive Early in 2025"; "MediaTek develops chip with TSMC's 3nm process"; "Apple A19, A19 Pro chips to use TSMC’s newer 3nm ‘N3P’ tech, iPhone 17 Air to replace Plus variant". Each article provides unique insights and information.