Samsung announces flagship Exynos 9 Series 9810 chip
Samsung has recently announced its newest Exynos 9 Series 9810 chip built on the world’s first 10nm FinFET process technology and is currently in mass production.
According to vice president of System LSI marketing at Samsung Electronics Ben Hur, the chip comes with third-generation custom CPU, ultra-fast gigabit LTE modem and, deep learning-enhanced image processing.
Under the hood, the Exynos 9810 features an octa-core CPU (four of which are custom third-generation custom cores that can reach 2.9 gigahertz (GHz), with the other four optimized for efficiency. Single-core performance is enhanced and multi-core performance rocketed to 40% compared to its predecessor.
The Exynos 9810 is embedded with Samsung’s first 1.2Gbps LTE modem and it’s also the first Cat.18 LTE that supports 6x carrier aggregation (CA) for 1.2Gbps downlink and 200 megabits per second (Mbps) uplink. The modem supports 4×4 MIMO (Multiple-Input, Multiple-Output) and 256-QAM (Quadrature Amplitude Modulation) scheme, and uses enhanced Licensed-Assisted Access (eLAA) technology.
Its MFC (multi-format codec) is also upgraded and supports video recording and playback up to UHD resolution at 120 frames per second (fps). It can also render 1,024 different tones for each primary color (red, green and blue) with 10-bit HEVC (high efficiency video coding) and VP9 support.
Source: Samsung Newsroom