#TSMC 2nm

The Tensor G6, internally codenamed “Malibu,” is also rumored to use TSMC’s N3P or 2nm process, depending on final production timelines. Internal documents leaked in late 2024 suggested the chip would use a 1+6 core configuration, but updated reports from mid-2025 hint at a possible 2nm upgrade for improved performance and energy efficiency. According to a new report, Apple secretly met with TSMC to secure production capacity for the chipmaker's upcoming 2-nanometer manufacturing process. The ‘secret meeting’ that reportedly involved Apple COO Jeff Williams and TSMC President Wei Zhejia. Their agenda included securing 2nm production capacity, not only for A- and M-Series chipsets, but also Apple’s in-house AI chips. Previously, Apple was able to secure all of TSMC’s 3nm production capacity in 2023. TSMC is said to begin mass production of 2nm chips in the second half of 2025. Read more in our articles including "Google Reportedly Testing MediaTek Modem for Tensor G6 and Pixel 11" and "Apple, TSMC had a ‘secret meeting’ to reserve 2nm production for A-, M-Series, new AI chips".