Intel has just announced its newest multigeneration partnership with Arm in building low-power processors on Intel’s 18A process technology.
The agreement sees both companies undertaking design technology co-optimization (DTCO), in which chip design and process technology are optimized together for the best performance and efficiency.

The partnership itself will focus on SoC design initially with expansion towards automotive, Internet of Things (IoT), data centers, aerospace, and government applications.
Intel also announced expansions in its chipset manufacturing capacity across the USA and the EU. The partnership also allows Arm partners to utilize Intel’s open system foundry model to its advantage.

Intel’s 18A process technology delivers two key technologies, PowerVia for better power delivery and the RibbonFET gate-all-around transistor architecture for optimal performance and efficiency.
“Intel’s collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology.” – Pat Gelsinger, CEO of Intel Corporation.

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