Qualcomm Snapdragon X24 2 Gbps LTE modem chipset officially announced
Qualcomm has officially announced world’s first 2 Gbps LTE modem called the Snapdragon X24. It’s also the first chip built on 7 nm FinFET process.
The Snapdragon X24 LTE modem supports “up to 7x carrier aggregation in the downlink”, including 4×4 MIMO on up to five aggregated LTE carriers. It also supports Cat.20 upload speeds, 3×20 MHz CA, and up to 256-QAM. It is paired with an advanced RF transceiver built in 14 nm FinFET process technology, as well as Qualcomm QET5100 Envelope tracker which makes it the first modem to support 60 MHz envelope tracking for up to 3x uplink carrier aggregation with High Power User Equipment (HPUE) support in Band 41.
“As the world’s first announced Gigabit LTE modem to achieve speeds of up to 2 Gbps, the Snapdragon X24 LTE modem sets a major mobile industry milestone, designed to provide enhanced mobile broadband and deliver an extremely important gigabit coverage layer for commercial 5G networks and mobile devices that are expected to start launching in 2019,” said Qualcomm Senior Vice President and General Manager of Wireless GmbH of 4G/5G and Industrial IOT, Serge Willenegger.
The Snapdragon X24 LTE will be demoed at MWC 2018 in partnership with Ericsson, NETGEAR, and Telstra.