#infineon coolsic

To promote and meet the coming requirements of green mobility, Infineon Technologies AG, a German semiconductor manufacturer will launch the CoolSiC power module that can reduce the energy consumption of railcars. The power module package is called the XHP 2, which consists of CoolSiC MOSFET chips. In addition, Infineon said that their chips can handle very demanding power cycles and constant temperature fluctuations, therefore increasing service life. In Infineon's XHP 2 power module, CoolSiC MOSFET chips enable low conversion losses while maintaining high reliability. Infineon's XHP 2 package features low stray inductance, a symmetrical and scalable design, and high current capacity. Reason enough to rely on new architectures, says Infineon’s Peter Schäfer. from Infineon’s AURIX TC3x family, is used to guarantee maximum functional safety. Peter Schäfer, Vice President and General Manager Automotive Microcontrollers, Infineon Technologies, heads the Automotive Microcontroller Business Unit at Infineon. Read more in our articles including "Infineon announces CoolSiC power module to reduce railcar energy consumption" and "Microcontrollers for automotive ECUs".