#MediaTek 5G chipset

The flagship Dimensity system-on-chip (SoC) from MediaTek has been taped out utilizing the 3nm technology from TSMC (TWSE: 2330, NYSE: TSM) with commercial manufacturing is anticipated to begin next year. The long-standing strategic partnership between MediaTek and TSMC has reached a significant turning point with the creation of flagship SoCs with high performance and low power features, enabling a wide range of end devices. “We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“ High performance computing and mobile applications may benefit from TSMC's 3nm process technology, that offers improved performance and power. The process technology used in MediaTek's Dimensity SoCs enables them to be constructed to fulfill the ever-increasing user experience demands of mobile computing, high-speed networking, artificial intelligence, and multimedia. MediaTek's first flagship chipset employing TSMC's 3nm process is set to power smartphones, tablets, intelligent automobiles, and numerous other gadgets in the second half of 2024. MediaTek has announced its latest 5G chipset for fixed wireless access routers and mobile hotspots, the T750 5G. Read more in our articles including "MediaTek develops chip with TSMC's 3nm process" and "MediaTek T750 5G chipset for Wireless Access Routers and Mobile Hotspots announced".