#MediaTek 9200+

MediaTek has just unveiled an all-new chipset for flagship 5G phones called the MediaTek Dimensity 9200+. The Dimensity 9200+ will combine one ultra-core Arm Cortex-X3 operating at up to 3.35 GHz, three Arm Cortex-A715 super cores that will run up to 3.0 GHz, and four Arm Cortex-A510 efficiency cores that operate at 2.0 GHz. In addition, the 11-core Arm Immortalis-G715 GPU in the 9200+ will be boosted by 17%. According to MediaTek, the 9200+ performs 10% and 5% faster on GeekBench 6.0's single and multi-core tests compared to last year's Dimensity 9200. The 9200+ will have a 4CC-CA 5G Release-16 modem that MediaTek says can fluidly switch between long-reach sub-6GHz and mmWave connections. Other key features of the 9200+ include its HyperEngine 6.0 gaming technology, Second Generation TSMC 4nm-class process, and a 6th Generation AI Processing Unit (APU 690) for AI tasks. The chip manufacturer says that they expect smartphones powered by the MediaTek Dimensity 9200+ to be released in May 2023. Mediatek will be unveiling two chipsets, namely, the Helio P23 and the Helio P30 at Beijing, China on August 29. Read more in our articles including "MediaTek Dimensity 9200+ unveiled" and "Mediatek to unveil Helio P23 and Helio P30 on August 29".