ARM has made official a new chipset, albeit quietly, the Dimensity 7050. The Dimensity 7050 supports dual 5G SIM, WiFi 6, and Bluetooth 5.2. The Dimensity 7050 is a slightly better chip than the Dimensity 7020. However, from the looks of it, the Dimensity 7050 seems identical to the Dimensity 1080. Reports indicate the Dimensity 7050 will be used on the upcoming Real 11 series. MediaTek has introduced the Dimensity 7500, its latest smartphone chipset designed for mainstream devices and the successor to the Dimensity 7400. Built using a 4nm process, the Dimensity 7500 is the first MediaTek chipset to use Arm’s new C1 CPU cores. MediaTek has just announced the world's first octa-core SOC for smartphones that supports 4G LTE connectivity and powered by the latest Cortex-A17 CPUs from ARM - the MT6595. Read more in our articles including "Mediatek Dimensity 7050 5G quitely unveiled" and "MediaTek announces Dimensity 7500 with new Arm C1 CPU cores".
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Aug 4, 2026ARM has made official a new chipset, albeit quietly, the Dimensity 7050. The Dimensity 7050 supports dual 5G SIM, WiFi 6, and Bluetooth 5.2.
The Dimensity 7050 is a slightly better chip than the Dimensity 7020. However, from the looks of it, the Dimensity 7050 seems identical to the Dimensity 1080. Reports indicate the Dimensity 7050 will be used on the upcoming Real 11 series.
Our coverage of mediatek dimensity 7050 phones includes: "Mediatek Dimensity 7050 5G quitely unveiled"; "MediaTek announces Dimensity 7500 with new Arm C1 CPU cores"; "Mediatek to unveil Helio P23 and Helio P30 on August 29". Each article provides unique insights and information.