For specs, the X7 Pro is rumored to debut the MediaTek Dimensity 8400 chipset, succeeding the Dimensity 8300 found in the X6 Pro. MediaTek has unveiled the Dimensity 1080—the successor to its mid-range chipset, Dimensity 920—that brings improved efficiency and performance, plus an upgraded camera support of up to 200MP for 5G smartphones. The realme C100 is powered by the MediaTek Helio G92 Max, while the C100i uses the Unisoc T7250 chipset. Read more in our articles including "POCO to Launch X7 Series Globally on January 9" and "MTK Dimensity 1080 5G SoC brings 200MP camera support".
Mark your calendars: POCO has officially announced the global launch of the X7 Series on…
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MediaTek has unveiled the Dimensity 1080—the successor to its mid-range chipset, Dimensity 920—that brings improved…
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Jun 18, 2026For specs, the X7 Pro is rumored to debut the MediaTek Dimensity 8400 chipset, succeeding the Dimensity 8300 found in the X6 Pro. MediaTek has unveiled the Dimensity 1080—the successor to its mid-range chipset, Dimensity 920—that brings improved efficiency and performance, plus an upgraded camera support of up to 200MP for 5G smartphones.
The realme C100 is powered by the MediaTek Helio G92 Max, while the C100i uses the Unisoc T7250 chipset.
Our coverage of mediatek midrange chipset includes: "POCO to Launch X7 Series Globally on January 9"; "MTK Dimensity 1080 5G SoC brings 200MP camera support"; "Qualcomm Reveals The Snapdragon 6 Gen 4 Chipset: Boosted Midrange Performance". Each article provides unique insights and information.