#mediatek tsmc

The flagship Dimensity system-on-chip (SoC) from MediaTek has been taped out utilizing the 3nm technology from TSMC (TWSE: 2330, NYSE: TSM) with commercial manufacturing is anticipated to begin next year. The long-standing strategic partnership between MediaTek and TSMC has reached a significant turning point with the creation of flagship SoCs with high performance and low power features, enabling a wide range of end devices. “We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“ High performance computing and mobile applications may benefit from TSMC's 3nm process technology, that offers improved performance and power. TSMC's 3nm technology now promises up to an 18% speed boost at the same power, a 32% power reduction at the same speed, and a roughly 60% increase in logic density when compared to the N5 process. The process technology used in MediaTek's Dimensity SoCs enables them to be constructed to fulfill the ever-increasing user experience demands of mobile computing, high-speed networking, artificial intelligence, and multimedia. Read more in our articles including "MediaTek develops chip with TSMC's 3nm process" and "Mediatek to unveil Helio P23 and Helio P30 on August 29".