#Qualcomm SM8845

Qualcomm is reportedly preparing to launch a new mid‑range powerhouse chipset, codenamed SM8845, that aims to bridge the gap between its Snapdragon 8s Gen 4 and the forthcoming Snapdragon 8 Elite 2. According to the leak, the SM8845 will be manufactured on TSMC’s advanced N3P 3nm process and feature Qualcomm’s high‑performance Oryon CPU cores—two prime cores paired with six additional performance cores. This configuration mirrors the Snapdragon 8 Elite series, though the SM8845 is expected to run at slightly lower clock speeds to maintain a more budget‑friendly price point. This strategy follows Qualcomm’s recent rebranding efforts. The rumored SM8845 comes at a critical time as competition in the mid‑range space intensifies. MediaTek’s Dimensity 9300 and 9400 chipsets have already demonstrated strong performance in devices like the OnePlus 12R and Vivo X100, pressuring Qualcomm to offer a compelling alternative. By equipping sub‑brands with near‑flagship silicon, Qualcomm can maintain its market dominance and cater to consumers seeking premium features at a lower cost. TSMC’s N3P node promises up to a 15% performance boost or 30% power reduction over the previous generation, which could translate into longer battery life for SM8845‑powered devices. Read more in our articles including "Qualcomm’s SM8845 Chipset Leak Promises Near‑Flagship Power for Budget Phones" and "Qualcomm outs smartphone & tablet w/ Snapdragon 810".