Qualcomm’s SM8845 Chipset Leak Promises Near‑Flagship Power for Budget Phones

Qualcomm is reportedly preparing to launch a new mid‑range powerhouse chipset, codenamed SM8845, that aims to bridge the gap between its Snapdragon 8s Gen 4 and the forthcoming Snapdragon 8 Elite 2. Leaks from prominent Weibo tipster Digital Chat Station suggest this “affordable flagship” processor will deliver near‑top‑tier performance to brands such as Redmi, Realme, and iQOO as early as autumn 2025.

According to the leak, the SM8845 will be manufactured on TSMC’s advanced N3P 3nm process and feature Qualcomm’s high‑performance Oryon CPU cores—two prime cores paired with six additional performance cores. This configuration mirrors the Snapdragon 8 Elite series, though the SM8845 is expected to run at slightly lower clock speeds to maintain a more budget‑friendly price point. While GPU details remain unconfirmed, insiders anticipate a scaled‑down Adreno GPU variant, capable of handling modern mobile games at high settings without the premium price tag.

This strategy follows Qualcomm’s recent rebranding efforts. Instead of releasing a Snapdragon 8 Gen 4, the company introduced the Snapdragon 8 Elite in late 2024—an unexpected move that aligned more closely with its Snapdragon X Elite laptop processors. The Elite now powers flagship devices like the Samsung Galaxy S25 Ultra and the Nubia Z70 Ultra. Meanwhile, the Snapdragon 8s Gen 4, which debuted in early 2025, combines ARM Cortex‑X4 and Cortex‑A720 cores but lacks the Oryon architecture, placing it just below the Elite in performance.

The rumored SM8845 comes at a critical time as competition in the mid‑range space intensifies. MediaTek’s Dimensity 9300 and 9400 chipsets have already demonstrated strong performance in devices like the OnePlus 12R and Vivo X100, pressuring Qualcomm to offer a compelling alternative. By equipping sub‑brands with near‑flagship silicon, Qualcomm can maintain its market dominance and cater to consumers seeking premium features at a lower cost.

Industry analysts also point to the importance of power efficiency. TSMC’s N3P node promises up to a 15% performance boost or 30% power reduction over the previous generation, which could translate into longer battery life for SM8845‑powered devices. This efficiency is crucial as smartphone makers continue to push for thinner designs and larger batteries without compromising performance.

Although Qualcomm has yet to confirm the SM8845’s specifications or launch date, the chipset is widely expected to debut alongside the Snapdragon 8 Elite 2 this autumn. If these rumors prove accurate, the SM8845 could redefine value in the Android ecosystem—offering flagship‑caliber experiences, robust 5G connectivity, and efficient power consumption to a broader range of consumers.