#Qualcomm Snapdragon leak

Qualcomm is reportedly preparing to launch a new mid‑range powerhouse chipset, codenamed SM8845, that aims to bridge the gap between its Snapdragon 8s Gen 4 and the forthcoming Snapdragon 8 Elite 2. According to the leak, the SM8845 will be manufactured on TSMC’s advanced N3P 3nm process and feature Qualcomm’s high‑performance Oryon CPU cores—two prime cores paired with six additional performance cores. Although Qualcomm has yet to confirm the SM8845’s specifications or launch date, the chipset is widely expected to debut alongside the Snapdragon 8 Elite 2 this autumn. A leak has surfaced saying that Qualcomm's upcoming top-of-the-line SoC for flagship smartphones, the Snapdragon 8 Gen 3, will launch earlier than when the Gen 2 debuted last year. Qualcomm has announced the new Snapdragon 6 Gen 5 and Snapdragon 4 Gen 5 processors. The Snapdragon 6 Gen 5 includes AI-powered camera features, Qualcomm Adaptive Performance Engine 4.0 for gaming, up to 21% better GPU performanc, and support for Wi-Fi 7 and ultra-fast 5G connectivity. According to Qualcomm, upcoming devices powered by Snapdragon 6 Gen 5 will come from brands including HONOR and REDMI. Qualcomm has announced the Snapdragon Wear Elite, a new processor designed for smartwatches and other wearable devices, bringing on-device AI features along with improved performance and battery life. Read more in our articles including "Qualcomm’s SM8845 Chipset Leak Promises Near‑Flagship Power for Budget Phones" and "Snapdragon 8 Gen 3, Xiaomi 14 launch details leaked".