Samsung Electronics has announced that it has started mass production of the industry's first high-density ePoP memory for flagship smartphones. Samsung's ePoP (embedded package on package) memory is a single memory package that consists of a 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card), and a controller. The ePoP memory has a maximum measurement of 225 square millimeters (15x15mm) and meets the semiconductor package height ceiling of 1.4 millimeters (mm). "By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features," Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics. Read more in our articles including "Samsung starts mass production of ePoP memory for smartphones" and "Samsung i900 Omnia Philippine Price".
Samsung Electronics has announced that it has started mass production of the industry's first high-density ePoP memory for flagship smartphones. Samsung's ePoP (embedded package on package) memory is a single memory package that consists of a 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card), and a controller.
The ePoP memory has a maximum measurement of 225 square millimeters (15x15mm) and meets the semiconductor package height ceiling of 1.4 millimeters (mm). "By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features," Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics.
Our coverage of samsung epop memory module includes: "Samsung starts mass production of ePoP memory for smartphones"; "Samsung i900 Omnia Philippine Price"; "Samsung Innov8 i8510 confirmed". Each article provides unique insights and information.