#soc

Harnessing the second-generation TSMC 4-nanometer process, the new system-on-chip (SoC) brings significant performance boost over its predecessor, the Dimensity 8200. As anticipated, the documents also state that the Snapdragon 8 Gen 3 SoC will include the Cortex-X4 prime, Cortex-A720 performance, and Cortex-A520 efficiency CPU cores. MediaTek on Tuesday announced the Dimensity 8100, Dimensity 8000, and Dimensity 1300 system-on-chips (SoCs) to bring flagship grade performance for premium 5G smartphones. Samsung Electronics and Marvell announced that the companies jointly developed a new System-on-a-Chip (SoC) that enhances 5G network performance. As per Samsung, the SoC is designed to help implement new technology that improves cellular radios by increasing their capacity and coverage while maintaining low power consumption and size. The SoC will be used in Samsung's MIMO and other radios—targetted to reach the Tier One operators' market in the second quarter of 2021. Samsung mentioned that the new SoC is equipped to support 5G and 4G networks simultaneously, capable of saving up to 70% in chipset power consumption than previous solutions. “We are excited to extend our collaboration with Marvell to unveil a new SoC that will combine both companies’ strengths in innovation to advance 5G network solutions,” said Junehee Lee, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. Read more in our articles including "MediaTek Dimensity 8300 unveiled: 4nm, 3.35GHz Arm Cortex-A715, on-device generative AI" and "Qualcomm Snapdragon 8 Gen 3 reportedly comes in both 4nm, 3nm variants".