AMD has provided the official details of the 3rd Gen AMD EPYC Milan-X processors with 3D-stacked L3 cache (dubbed 3D V-Cache). Along with this, the company also revealed the details on an expanded set of next-generation EPYC processors powered by “Zen 4” and “Zen 4c” CPU core.
AMD’s new 3rd Gen EPYC CPU with 3D V-Cache, codenamed Milan-X, is the company’s first server CPU with 3D chiplet technology.
The processors have three times the L3 cache compared to regular Milan processors. According to AMD, its new cache-stacking technology, which it will add to the existing Zen 3-powered EPYC Milan models to create the new Milan-X chips, will bring up to 768MB of total L3 cache per chip.
Milan-X represents an innovative step forward in CPU design and packaging and will offer a 50% average performance uplift across targeted technical computing workloads. In addition, AMD also mentioned that the 3D V-Cache can improve gaming performance by 15%.
Meanwhile, Microsoft Azure HPC virtual machines featuring 3rd Gen EPYC with AMD 3D V-Cache are available today in Private Preview, with a broad rollout in the coming weeks.
The 3rd Gen EPYC CPUs with AMD 3D V-Cache will launch in Q1 2022. Companies that plan to offer server solutions with these processors include Cisco, Dell Technologies, Lenovo, HPE, and Supermicro.
Source: AMD
