#hisilicon kirin

The US Government has, however, given Huawei a 120-day grace period before the ruling takes effect; hence TSMC can still provide chips to HiSilicon until September 15. Given the ruling, Huawei is forced to find a third party chip manufacturer for its 2021 flagship devices. Huawei finally announced the HiSilicon Kirin 710, the successor to last year's Kirin 659. The new chip will be the brand's new fighter for the mid-range segment The Kirin 710 is now riding on a 12nm architecture as opposed to the 659's 16nm. A couple of months go, Huawei unveiled its latest flagship chipset, the HiSilicon Kirin 990 Series, which powers the company's newest smartphones, the Mate 30 series. Before we get started, the Kirin 990 comes in two models: the Kirin 990 5G and the Kirin 990 4G. TSMC 7nm lithography The Kirin 990 is built using TSMC’s 7nm lithography, allowing them to fit 8 billion transistors in about a 90mm2 die size. For comparison, the Kirin 980 has 6.9 billion transistors in a 74mm2 die size. CPU, GPU, and NPU Power For the CPU, the Kirin 990 5G features two high-frequency 2.86GHz Cortex-A76-based cores, two medium-frequency 2.09GHz Cortex-A76-based cores, and four efficient 1.86GHz Cortex-A55 cores. Read more in our articles including "Huawei's 2021 flagships may use MediaTek Dimensity Chips" and "HiSilicon Kirin 710 officially announced".