Intel LakeField

Intel has announced its latest Core Processors with Hybrid Technology and Foveros 3d packaging technology. Intel's new Hybrid processors are capable of delivering full Windows 10 application compatibility in up to a 56% smaller package and 47% smaller board size, as well as longer battery life. It features: Smallest package thanks to Foveros: By leveraging Foveros' stacking technology, Intel was able to create the chipset measuring jus 12 x 12 x 1mm. Intel UHD for AI-enhanced workloads: The GPU engine is capable of delivering sustained performance for AI-enhanced video stabilization, analytics, and image resolution upscaling. Gigabit connectivity: With Intel's WiFi 6 (Gig+) and Intel LTE solutions, users may experience seamless video conferencing and streaming online. Got the official statement from Intel Corporation today and it turns out bigger than we originally expected and involves around 5,000 to 6,000 employees worldwide, including 1,800 in the Philippines. Copy of the full disclosure below: Chuck Mulloy Intel Corporation Santa Clara, California, Jan. 21, 2009 – Intel Corporation today disclosed plans to restructure some of its manufacturing operations and align its manufacturing capacity to current market conditions. Read more in our articles including "Intel announces Hybrid Processors for Innovative Form Factors" and "OnePlus Watch Lite now official".