#samsung epop memory package

Samsung Electronics has announced that it has started mass production of the industry's first high-density ePoP memory for flagship smartphones. Samsung's ePoP (embedded package on package) memory is a single memory package that consists of a 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card), and a controller. Before ePoP, conventional PoP packages consist of the mobile processor and DRAM, with the eMMC located in a separate package which takes up space. By utilizing the ePoP's "one-package" design, smartphone manufacturers can now save some space and use it for other key components like a bigger battery. The ePoP memory has a maximum measurement of 225 square millimeters (15x15mm) and meets the semiconductor package height ceiling of 1.4 millimeters (mm). "By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features," Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics. Read more in our articles including "Samsung starts mass production of ePoP memory for smartphones" and "Insta360 Luna Ultra launched, priced in the Philippines".