MediaTek develops chip with TSMC's 3nm process

Dimensity에서 개발한 최신형 시스템온칩(SoC)이 TSMC(TWSE: 2330, NYSE: TSM)의 3nm 기술을 활용해 생산 준비 단계에 진입했으며, 상용 생산은 내년 초에 시작될 것으로 예상됩니다. MediaTek와 TSMC 간의 오랜 전략적 파트너십은 고성능 저전력 기능을 갖춘 최신형 SoC 개발을 통해 새로운 전환점을 맞이했으며, 이를 통해 다양한 최종 기기 개발에 기여하고 있습니다. 양사는 칩 설계 및 제조 분야에서 강점을 활용하여 이 성과를 달성했습니다.

“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”

“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“

High performance computing and mobile applications may benefit from TSMC's 3nm process technology, that offers improved performance and power. TSMC's 3nm technology now promises up to an 18% speed boost at the same power, a 32% power reduction at the same speed, and a roughly 60% increase in logic density when compared to the N5 process.

The process technology used in MediaTek's Dimensity SoCs enables them to be constructed to fulfill the ever-increasing user experience demands of mobile computing, high-speed networking, artificial intelligence, and multimedia. MediaTek's first flagship chipset employing TSMC's 3nm process is set to power smartphones, tablets, intelligent automobiles, and numerous other gadgets in the second half of 2024.