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Upcoming Meizu E3’s specs appears at TENAA




It’s confirmed that the upcoming Meizu E3 is bound to have its release on March 6. However, the specs of the said smartphone has appeared at TENAA, showing a 5.99-inch 18:9 Full HD+ display and a vertically placed dual rear camera setup just like the iPhone X.

While it’s still unspecified which chipset the E3 will be using, it has been said that it might be powered by upcoming Helio P70 octa-core processor, clocked at up to 1.8GHz. There will be two RAM and internal storage variant: 4GB/32GB or 6GB/128GB. Its microSD slot can support up to 128GB. Camera-wise, it will sport a 12MP + 20MP dual rear cameras while its front shooters will be at 8MP. The fingerprint scanner is located on the side. Just like the Meizu M6s, the E3 lacks physical home button and is replaced by small circle called Super mBack.

Other specs include running on Android 7.1.1 Nougat skinned with Flyme 6 and a 3,300mAh battery which supports 18W fast-charging technology. It will be available in three colors: Obsidian Black, Champagne Gold, and Dark Blue.

Details like specs are yet to be announced but it is rumored to be priced at CNY 2,000 (~Php 16,373)

Source: GSMArena



Alyza is a Multimedia Producer for YugaTech. You can follow her at @tadboring.

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