The future generation of mainstream 5G devices will be enhanced by MediaTek‘s new Dimensity 6000 series and chipset, which were officially announced today. The Dimensity 6100+ SoC offers quality features at a cheap price, including industry-leading low power consumption, robust Sub-6 5G connection, vivid screens, quick frame rates, and AI-powered camera capabilities.
“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, “The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.”
The Dimensity 6100+ features a more powerful 5G modem that supports the 3GPP Release 16 standard and up to 140MHz 2CC 5G Carrier Aggregation, as well as MediaTek UltraSave 3.0+ technology to minimize battery consumption. This processor offers exceptional UX and GPU performance, two Arm Cortex-A76 big cores, six Arm Cortex-A55 efficiency cores, compatibility for 10-bit displays, AI-powered cameras, and a wide range of peripheral features.
Other key features of the Dimensity 6100+ chipset include:
MediaTek’s 5G range spans several pricing tiers. The Dimensity 8000 family is targeted at high-end mobile devices, the Dimensity 7000 lineup broadens the company’s selection of high-tech gadgets, and the Dimensity 9000 series is made for flagship smartphones and tablets. Higher-end functions will soon be made available on more affordable 5G smartphones thanks to the new Dimensity 6000 series.
The Dimensity 6100+ chipset will debut in the third quarter of 2023 in the first smartphones.
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