The future generation of mainstream 5G devices will be enhanced by MediaTek's new Dimensity 6000 series and chipset, which were officially announced today. Other key features of the Dimensity 6100+ chipset include: Up to 108MP Non-ZSL camera support. The Dimensity 6100+ chipset will debut in the third quarter of 2023 in the first smartphones. MediaTek has introduced the Dimensity 7500, its latest smartphone chipset designed for mainstream devices and the successor to the Dimensity 7400. Built using a 4nm process, the Dimensity 7500 is the first MediaTek chipset to use Arm’s new C1 CPU cores. Read more in our articles including "MediaTek Dimensity 6000 series launched" and "MediaTek announces Dimensity 7500 with new Arm C1 CPU cores".
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Jun 24, 2026The future generation of mainstream 5G devices will be enhanced by MediaTek's new Dimensity 6000 series and chipset, which were officially announced today. Other key features of the Dimensity 6100+ chipset include: Up to 108MP Non-ZSL camera support.
The Dimensity 6100+ chipset will debut in the third quarter of 2023 in the first smartphones. MediaTek has introduced the Dimensity 7500, its latest smartphone chipset designed for mainstream devices and the successor to the Dimensity 7400. Built using a 4nm process, the Dimensity 7500 is the first MediaTek chipset to use Arm’s new C1 CPU cores.
Our coverage of mediatek dimensity 6100+ chipset phones includes: "MediaTek Dimensity 6000 series launched"; "MediaTek announces Dimensity 7500 with new Arm C1 CPU cores"; "Mediatek to unveil Helio P23 and Helio P30 on August 29". Each article provides unique insights and information.