#mediatek chipset

MediaTek has introduced the Dimensity 7500, its latest smartphone chipset designed for mainstream devices and the successor to the Dimensity 7400. Built using a 4nm process, the Dimensity 7500 is the first MediaTek chipset to use Arm’s new C1 CPU cores. The chipset also introduces the MediaTek NPU 850, which is designed for on-device generative AI tasks. MediaTek said the new NPU delivers more than twice the AI processing performance compared to the previous generation and supports features such as speech recognition, smart replies, and notification summaries without depending entirely on cloud processing. Mediatek will be unveiling two chipsets, namely, the Helio P23 and the Helio P30 at Beijing, China on August 29. Expect the chipset to come with Cat.7 connectivity and LPDDR4X memory. On the other hand, the more powerful Helio P30 (and known to be most powerful chipset in the P series) is going to be manufactured on TSMC’s 12 nm process. Connectivity-wise, the chipset is said to come with Cat.10, which can get you up too 600Mbps of download speed. Read more in our articles including "MediaTek announces Dimensity 7500 with new Arm C1 CPU cores" and "Mediatek to unveil Helio P23 and Helio P30 on August 29".