mediatek tsmc chipset

The flagship Dimensity system-on-chip (SoC) from MediaTek has been taped out utilizing the 3nm technology from TSMC (TWSE: 2330, NYSE: TSM) with commercial manufacturing is anticipated to begin next year. The long-standing strategic partnership between MediaTek and TSMC has reached a significant turning point with the creation of flagship SoCs with high performance and low power features, enabling a wide range of end devices. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“ High performance computing and mobile applications may benefit from TSMC's 3nm process technology, that offers improved performance and power. MediaTek's first flagship chipset employing TSMC's 3nm process is set to power smartphones, tablets, intelligent automobiles, and numerous other gadgets in the second half of 2024. Mediatek will be unveiling two chipsets, namely, the Helio P23 and the Helio P30 at Beijing, China on August 29. On the other hand, the more powerful Helio P30 (and known to be most powerful chipset in the P series) is going to be manufactured on TSMC’s 12 nm process. It is powered by the MediaTek Dimensity 6300 chipset with 8GB of RAM while having up to 16GB of virtual RAM available. Read more in our articles including "MediaTek develops chip with TSMC's 3nm process" and "Mediatek to unveil Helio P23 and Helio P30 on August 29".