MediaTek has officially announced new, second-generation of Wi-Fi 7 products: the Filogic 860, a chipset aimed for network devices, and the Filogic 360 modem for client devices including smartphones and laptops.
Filogic 860
The Filogic 860 features a low-power design, based on 6-nanometer process. The chipset features three-core Arm Cortex-A73 processor that is capable to power advanced tunneling and security features for enterprise users and service providers.
It brings up to 7.2Gbps speeds through its Single-MAC MLO and Wi-Fi 7 technologies. Dual-band, dual-concurrent connectivity support, as well as Filogic Xtra range technology for that maximizes 5/6GHz reach.
Filogic 360
For the Filogic 360, it comes with Wi-Fi 7 2×2, triple-band support with up to 2.9Gbps speeds.
Its channel bandwidth is up to 160MHz and also features Filogic Xtra range that offers improved connectivity if far enough from an access point.
It pairs Bluetooth 5.4 that supports BLE Audio and integrated DSP with LC3 codec. MediaTek says that Filogic 360 incorporates an advanced technology, ensuring that even if running on 2.4GHz band, both Wi-Fi 7 and Bluetooth signals operate harmoniously without interference.
The company says it expects mass production to commence in mid-2024.
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