MediaTek has announced the successors to the Dimensity 7300 chipsets with the MediaTek Dimensity 7400 and 7400X.
The Dimensity 7400 and 7400X are built on TSMC’s 4nm process node. Both chipsets integrate an octa-core CPU with 4X Arm Cortex-A78 cores operating up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz. An Arm Mali-G615 MC2 GPU comes in the processor.
“With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business. “Whether gaming, using the latest AI applications, or taking photos and videos, users can enjoy the significant performance and impressive energy efficiency that they have come to expect from the Dimensity family.”
The MediaTek Dimensity 7400X has support for dual display in flip phones to give OEMs more design flexibility. Both processors also have tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity
The MediaTek Dimesity 7400 series is said to be available in Q1 2025. Alongside this announcement is the MediaTek Dimensity 6400 chipset which is currently available.
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