MediaTek has just unveiled its latest entry-level 5G chip, the Dimensity 6400. It’s essentially a small update to last year’s Dimensity 6300, with just a slightly faster prime core.
The Dimensity 6400 still uses TSMC’s 6nm process, keeps the same octa-core setup, and even carries over the same GPU as its predecessor.
The chipset features an octa-core architecture: two Cortex-A76 cores at 2.5GHz and six Cortex-A55 cores at 2.0GHz. The only difference from the 6300 is that MediaTek has slightly overclocked the prime core from 2.4GHz to 2.5GHz, but don’t expect a noticeable performance jump.
It also supports multi-core processing to manage tasks more efficiently.
Weirdly enough, the Dimensity 6100+ from 2023 already had similar specs, making this feel like a rebadged chip with just a minor speed boost.
For graphics, the new chip sticks with the Arm Mali-G57 MC2 GPU, and it supports displays up to 2520 x 1080 resolution with a 120Hz refresh rate.
For photography, its Image Signal Processor (ISP) supports cameras up to 108MP, with dual-camera setups capped at 16MP + 16MP. There aren’t any major upgrades in terms of computational photography or camera features, though it does include color management for better image quality.
Furthermore, it supports LPDDR4x RAM at up to 2133MHz and UFS 2.2 storage. While these aren’t the fastest options available, they’re sufficient for mid-range smartphones.
Connectivity-wise, the Dimensity 6400 supports both SA and NSA 5G with dual SIM functionality, offering peak download speeds of up to 3.3Gbps. It also features 5G carrier aggregation and VoNR for better call quality on 5G networks.
Wi-Fi standard supports remained to be Wi-Fi 5 (802.11ac). See more technical info about the new chipset here.
The first phone to launch with the Dimensity 6400 will be the realme P3x 5G, which will be available in India starting February 18th.
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