MediaTek Dimensity 6300 chipset now official

The MediaTek Dimensity 6300 is now official, which is their latest midrange chipset succeeding last year’s Dimensity 6100+ offering.

The Dimensity 6300 features two Cortex-A76 performance cores that clocks up to 2.4GHz and six Cortex-A55 efficiency cores clocking up to 2GHz.

This chipset is manufactured via TSMC’s 6nm process, paired with a Mali-G57 MC2 GPU. MediaTek claims that the new chip offers a modest 10% CPU performance boost in comparison to its predecessor.

As with its predecessor, the Dimensity 6300 supports LPDDR4x RAM and UFS 2.2 storage. It also powers displays that peak at 2520 by 1080 resolution.

For other features, the chip can also support 108MP main cameras, dual-band Wi-Fi 5, and Bluetooth 5.2 connectivity.

Additionally, the chipset features MediaTek UltraSave 3.0+ technology for power saving. It also has an integrated 5G modem, compliant with the 3GPP Release 16 standard.

It’s rumored that the first phone to be launched later this month with the MediaTek Dimensity 6300 is the realme C65 5G 23 variant.