HUAWEI MatePad 12 X (2026) Review
Shortly after Qualcomm’s reveal of the Snapdragon 7 Gen 3, a Geekbench listing has revealed.
A Geekbench listing 12 has revealed key specs to the MediaTek Dimensity 8300. It also appears to be powering a Redmi device.
The chipset was able to score 1,512 in Single-Core performance while scoring 4,886 in Muli-Core. It also revealed that the chipset has a Cortex-X3 core maxed at 3.35GHz, three Cortex-A715 up to 3.2GHz, and four Cortex-A510 cores clocked at 2.2GHz.
The Dimensity 8300 uses an ARM Mali-G615 MP6 as its GPU and manufactured on TSMC’s 4nm process.
The MediaTek Dimensity 8300 chipset is set to officially debut on November 21 so we’ll know more by then.
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