#mediatek dimensity 6100+ devices

The future generation of mainstream 5G devices will be enhanced by MediaTek's new Dimensity 6000 series and chipset, which were officially announced today. The Dimensity 6100+ SoC offers quality features at a cheap price, including industry-leading low power consumption, robust Sub-6 5G connection, vivid screens, quick frame rates, and AI-powered camera capabilities. Other key features of the Dimensity 6100+ chipset include: Up to 108MP Non-ZSL camera support. Powerful camera features including AI-bokeh for stunning portraits and selfies; working with Arcsoft, MediaTek is also bringing AI-color technology to mainstream devices so users can showcase their creativity. The Dimensity 8000 family is targeted at high-end mobile devices, the Dimensity 7000 lineup broadens the company's selection of high-tech gadgets, and the Dimensity 9000 series is made for flagship smartphones and tablets. The Dimensity 6100+ chipset will debut in the third quarter of 2023 in the first smartphones. MediaTek has introduced the Dimensity 7500, its latest smartphone chipset designed for mainstream devices and the successor to the Dimensity 7400. Built using a 4nm process, the Dimensity 7500 is the first MediaTek chipset to use Arm’s new C1 CPU cores. Read more in our articles including "MediaTek Dimensity 6000 series launched" and "MediaTek announces Dimensity 7500 with new Arm C1 CPU cores".