MediaTek has recently introduced its latest flagship processor, the MediaTek Dimensity 9000 5G.
The Dimensity 9000 5G is dubbed the world’s first TSMC chip built on the 4nm process with improved performance and power efficiency. In addition, the new sub-6GHz 5G chipset is the first smartphone chip to use a Cortex-X2 core clocked at up to 3.05Ghz and is the world’s-first smartphone chip to include Bluetooth 5.3.
For graphics, it comes with a new Mali-G710 GPU with 10-cores, along with MediaTek’s fifth-generation APU with six total cores for AI processing.
The new APU (AI Processing Unit) supports up to four times better performance than the previous generation and leads performance on ETHZ, an AI benchmark test. Moreover, the company claims the Dimensity 9000 5G outperforms the Google Tensor by 16% in AI performance.
In addition, for connectivity, it also supports Wi-Fi 6E 2×2, a new Beidou III-B1C GNSS standard, and Wireless Stereo Audio.
The first smartphones running the MediaTek Dimensity 9000 5G will arrive in late Q1 2022.
Source: GSMArena
