Qualcomm officially announced yesterday, the arrival of their latest flagship mobile platform — the Snapdragon 845. Today, the company unveiled what’s under the hood of the Snapdragon 845 including the new features it will bring into the mobile computing world.
Qualcomm’s Snapdragon chips are not just processors but rather a complete platform for internal hardware which include modems, GPU’s, camera modules, WiFi units and more. As such the new Snapdragon chip will include new and improved graphics in the form of Adreno’s 630 GPU, an updated Qualcomm Spectra 280 image signal processor (ISP), a new AI system, the latest Snapdragon X20 LTE modem and the Kryo 385 CPU, among others.
The new Adreno 630 enables devices to capture 64x higher dynamic range color information for video capture and playback on Ultra HD displays. It also has improved color depth for better 4K/Ultra HD video viewing. Qualcomm updated the chips AI and biometric security system by implementing smarter voice commands and adding a secure processing unit (SPU).
As for connectivity, the Snapdragon 845’s X20 LTE modem supports the LTE Cat 18 category bringing with it peak downloads of1.2Gbps, up to 5x carrier aggregation, License Assisted Access (LAA), Dual SIM-Dual VoLTE, and 4×4 MIMO.
Check out more details about the Snapdragon 845’s specs and features below.
Qualcomm Spectra 280 ISP
- Ultra HD premium capture
- Qualcomm Spectra Module Program, featuring Active Depth Sensing
- MCTF video capture
- Multi-frame noise reduction
- High-performance capture up to 16MP @60FPS
- Slow motion video capture (720p @480 fps)
- ImMotion computational photography
Adreno 630 Visual Processing Subsystem
- 30% improved graphics/video rendering and power reduction compared to the previous generation
- Room-scale 6 DoF with SLAM
- Adreno foveation, featuring tile rendering, eye tracking, multiView rendering, fine grain preemption
2K x 2K @ 120Hz, for 2.5x faster display throughput - Improved 6DoF with hand-tracking and controller support
Qualcomm® Hexagon™ 685 DSP
- 3rd Generation Hexagon Vector DSP (HVX) for AI and imaging
- 3rd Generation Qualcomm All-Ways AwareTM Sensor Hub
- Hexagon scalar DSP for audio
Snapdragon X20 LTE Modem
- Support for 1.2 Gbps Gigabit LTE Category 18
- License Assisted Access (LAA)
- Citizens Broadband Radio Service (CBRS) shared radio spectrum
- Dual SIM-Dual VoLTE (DSDV)
Connectivity
- Multigigabit 11ad Wi-Fi with diversity module
- Integrated 2×2 11ac Wi-Fi with Dual Band Simultaneous (DBS) support
- 11k/r/v: Carrier Wi-Fi enhanced mobility, fast acquisition, and congestion mitigation
- Bluetooth 5 with proprietary enhancements for ultra-low power wireless earbud support and direct audio broadcast to multiple devices
Secure Processing Unit
- Biometric authentication (fingerprint, iris, voice, face)
- User and app data protection
- Integrated use-cases such as integrated SIM, Payments, and more
Qualcomm Aqstic Audio
- Qualcomm Aqstic audio codec(WCD934x):
Playback:
- Dynamic range: 130dB, THD+N: -109dB
- Native DSD support (DSD64/DSD128), PCM up to 384kHz/32bit
- Low power voice activation: 0.65mA
Record:
- Dynamic range: 109dB, THD+N: -103dB
- Sampling: Up to 192kHz/24bit
Qualcomm® Quick Charge™ 4+
Kryo 385 CPU
- Four performance cores up to 2.8GHz (25 percent performance uplift compared to the previous generation)
- Four efficiency cores up to 1.8GHz
- 2MB shared L3 cache (new)
- 3MB system cache (new)
10-nanometer (nm) LPP FinFET process technology
source: Qualcomm
